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hal-01473890v1
Journal articles
Experimental Characterization of the Predictive Thermal Behaviour Model of a Surface-Mounted Soft Magnetic Composite Inductor Microelectronics Reliability, Elsevier, 2016, 67, pp.54-63. ⟨10.1016/j.microrel.2016.09.020⟩ |
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hal-01473797v1
Journal articles
Analytical Thermal Modelling of Multilayered Active Embedded Chips into High Density Electronic Board Thermal Science, VINČA Institute of Nuclear Sciences, 2013, 17 (3), pp.695-706. ⟨10.2298/TSCI120826072M⟩ ![]() |
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hal-01473744v1
Journal articles
Analytical Modeling of Multi-Layered Printed Circuit Board Using Multi-Stacked via Clusters as Component Heat Spreader Thermal Science, VINČA Institute of Nuclear Sciences, 2016, 20 (5), pp.1633-1647 |
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