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	hal-01473797v1 Journal articles Eric Monier-Vinard, Najib Laraqi, Cheikh Tidiane Dia, Minh Nhat Nguyen, Valentin Bissuel. Analytical Thermal Modelling of Multilayered Active Embedded Chips into High Density Electronic Board Thermal Science, VINČA Institute of Nuclear Sciences, 2013, 17 (3), pp.695-706
	hal-02490728v1 Journal articles Syou-P'Heng Do, Amine Missaoui, Alessandro Coati, Andrea Resta, Nicolas Goubet et al. Interactions Between Topological Defects and Nanoparticles Frontiers in Physics, Frontiers, 2020, 7, pp.234. ⟨10.3389/fphy.2019.00234⟩
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